Tempo Automation
2460 Alameda
San Francisco CA 94103
Tel: +1-415-320-1261
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Listing Date | Expiration Date |
| Yes | Yes | Yes | 4/15/2019 | 4/15/2022 |
J-STD-001 Space/Military Addendum
| Listing Date | Expiration Date |
| 4/15/2019 | 4/15/2022 |
Capabilities
- Cleaning Process Capable
- DFM (Design for Manufacturability) Capable
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Standard Leaded (63/37) Assembly Process Capable
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
- Wavesolder and Selective Solder Capable