Zentech Manufacturing
6980 Tudsbury Road
Baltimore, MD 21244
USA
Tel: +1 443-348-4500

IPC J-STD-001/610

Class 1	Class 2	Class 3	Listing Date	Expiration Date
Yes	Yes	Yes	9/23/2020	9/23/2023

Capabilities

• Conformal Coating Process Capable
• Gold (Au) Removal Process Capable
• Cleaning Process Capable
• Hot Bar Soldering for Rigid Flex Assembly
• Intrusive Soldering (Paste-in-Hole) Capable
• Lead-Free Assembly Process Capable
• Plated Through Hole Component Assembly
• Press Fit (Compliant Pin) Process Capable
• Process Validation
• Rework and Repair Process Capable
• Staking (Adhesive) and Encapsulation Capable
• Standard Leaded (63/37) Assembly Process Capable
• Statistical Process Control (SPC)
• Surface Mount Component Assembly
• Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
• Unique Surface Mount Component Types: Ball Grid Array, Flip-Chip, Micro BGA (0.25-mm pitch), 0201’s