IPC Validation Services

J-STD-001/IPC-A-610

IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001 standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.

IPC-A-610: Acceptability of Electronic Assemblies is the most widely used electronics assembly acceptance standard in the electronics industry. Participants from 29 countries provided their input and expertise to bring this document to the electronics industry.

J-STD-001 is developed in synergy with IPC-A-610.

The IPC Validation Services QML (Qualified Manufacturers List) is used to qualify EMS and OEM providers’ assembly processes to IPC standards. 

The following manufacturers have qualified for the J-STD-001/IPC-A-610 IPC standards:

ALPHA-elektronik A/S, Næstved, Denmark

ALPHA-elektronik A/S
Lunavej 6
DK-4700
Næstved, Denmark
Tel: +45 55 77 37 73

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 6/21/2016 6/28/2019 6/28/2022

Capabilities

  • Process Validation
  • Surface Mount Component Assembly
  • Lead-Free Assembly Process Capable
  • Rework and Repair Process Capable
  • Cleaning Process Capable
  • DFM (Design for Manufacturability) Capable
  • Conformal Coating Process Capable
  • Wavesolder and Selective Solder Capable
  • PoP (Package on Package) Process Capable
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s

Alternative Manufacturing Inc., Winthrop, ME, USA

Alternative Manufacturing Inc. (AMI)
30B Summer St.
Winthrop, ME, 04364-1253 USA
207-377-9377

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 4/8/2015 4/15/2021 4/15/2024

Capabilities:

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays, Micro BGA (0.30-mm pitch), 0201’s
  • Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
  • Wavesolder and Selective Solder Capable
  • Wire and Terminal Connection Process Capable

Askey Technology (Jiangsu) Ltd., Suzhou, P.R.C., Factory 2

Askey Technology (Jiangsu) Ltd.
Building #2
No. 1388 Jiaotong Road
Wujiang Economic Technological Development Area
Suzhou, Jiangsu, P.R.C. 215200
Tel: +86-512-63487188

IPC J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 9/7/2020 9/7/2020 9/7/2023

Capabilities

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wavesolder Capable
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Unique Surface Mount Component Types: 0201’s and 01005’s

Askey Technology (Jiangsu) Ltd., Suzhou, P.R.C., Factory 3

Askey Technology (Jiangsu) Ltd.
Building # 3 (SC01/DC01)
No.1388 Jiaotong Road
Wu Jiang Economic Technology Development Area
Jiangsu Province215200, P.R.C
Tel: +86-512-6348-7188

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 6/18/2015 7/15/2021 7/15/2024

Capabilities

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Staking (Adhesive) and Encapsulation Capable
  • Wavesolder Capable
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Unique Surface Mount Component Types:  0201’s and 01005’s

BCS Automotive Interface Solutions (Suzhou) Co., Ltd.

BCS Automotive Interface Solutions (Suzhou) Co., Ltd.
No. 2052, Taidong Road
Xiangcheng Economic Development District
Suzhou, Jiangsu Province
215143 China

IPC J-STD-001 / IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 1/25/2017 3/30/2020 3/30/2023

Capabilities

  • Lead-Free Assembly Process Capable
  • Surface Mount Component Assembly
  • Plated Through Hole Component Assembly
  • Wavesolder and Selective Solder Capable
  • Process Validation
  • Statistical Process Control (SPC)
  • Press Fit (Compliant Pin) Process Capable
  • Intrusive Soldering (Paste-in-Hole) Capable

Changzhou Bokang Electronics Co., Ltd., Changzhou, Jiangsu, China

Changzhou Bokang Electronics Co., Ltd.
65-15# Xinggang Road,
Zhonglou Zone

Changzhou, Jiangsu, China 213023
TEL. +1 3915080590

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 12/15/2020 12/15/2020 12/15/2023

Capabilities:

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: BGA
  • Wavesolder Capable

Cincon Electronics Co., Ltd., Changhua County, Taiwan (R.O.C.)

Cincon Electronics Co., Ltd.
No. 8-1 Fugong Rd.,
Fuxing Township
Changhua, 50662
Taiwan
Tel: +88647690261
https://www.cincon.com

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 8/25/2021 8/25/2021 8/25/2024

Capabilities:

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wavesolder Capable

DFI, Inc., Taoyuan City, Taiwan (R.O.C.)

DFI, Inc.
3F., No. 157, Shanying Road
Guishan District
Taoyuan City, 333424 Taiwan (R.O.C.)
Tel: +886 (3) 216-5058

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 8/22/2016 12/28/2021 12/28/2024


Capabilities

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wavesolder Capable

Dong Guan Lightion Electronics Co., Ltd.

Dong Guan Lightion Electronics Co., LTD.
Meilin District Dalingshan
Dongguan, Guangdong Province
523000 P.R.C
Telephone  +86-769-83352904

IPC J-STD-001 / IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 4/26/2020 4/26/2020 4/26/2023

Capabilities

  • Lead-Free Assembly Process Capable
  • Internal Failure Analysis Lab Capabilities
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: BGA

DongGuan Cincon Electronic Limited

DongGuan Cincon Electronic Limited
No. 1, Jing Xiang Road,
DongCheng Foreign Trade Industrial Park,
Zhushan, DongCheng District,
Dongguan, Guangdong, P.R.C. 523128
Telephone: +86-769-22258876

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 5/28/2021 5/28/2021 5/28/2024

Capabilities

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wire and Terminal Connection Process Capable

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Eskilstuna Elektronik Partner AB, Eskilstuna, Sweden

Eskilstuna Elektronik Partner AB
Gustafsvagen 20
Eskilstuna, Sweden, 633 46
Tel: +0046 1615 9800

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 11/8/2019 11/8/2019 11/8/2022

Capabilities:

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays and QFN
  • Wavesolder and Selective Solder Capable
  • Wire and Terminal Connection Process Capable
  • Process Validation

Excel Electronics, Inc., Elkhart, IN, USA

Excel Electronics, Inc.
2600 Marina Dr.
Elkhart, IN 46514
Phone: 574-206-2627
Fax: 574-264-7052

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 6/9/2017 6/4/2020 6/4/2023

Capabilities:

  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Hot Bar Soldering for Rigid Flex Assembly
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Pin Staking Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
  • Wave solder and Selective Solder Capable

Fabrication Technologies, Inc. / IGM Solutions, Inc., Libertyville, IL, USA

Fabrication Technologies, Inc. / IGM Solutions, Inc.
1925 Enterprise Ct
Libertyville, IL, 60048-9764
United States
Tel: 847-362-9800
Fax: 847-362 5531

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 1/9/2020 1/9/2020 1/9/2023

Capabilities:

  • DFM (Design for Manufacturability) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
  • Wavesolder and Selective Solder Capable

 

Flextronics Computing (Suzhou) Co., Ltd., Suzhou, P.R.C.

Flextronics Computing (Suzhou) Co., Ltd.
No.1, Wusongjiang Ave.
Guoxiang St., Wuzhong District
Suzhou, Jiangsu, China
Tel: +86 512 6340 8800

J-STD-001/IPC-A-610

For Automotive line C9, C10 and C11 & C12

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 6/20/16 8/5/2019 8/5/2022

Capabilities:

  • Lead-Free Assembly Process Capable
  • Surface Mount Component Assembly
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Conformal Coating Process Capable

Fujian Sked Electronics Technology Co., Ltd, Zhangzhou, Fujian, P.R.C

Fujian Sked Electronics Technology Co., Ltd
No.20, Jinxia North Road,
Sui’an Industrial Zone
Zhangzhou, Fujian, P.R.C
363200  P.R.C
Telephone + 0596-3871688

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 10/8/2019 10/8/2019 10/8/2022

Capabilities:

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays

Golden Elite Technology (Shenzhen) Ltd. Shenzhen City, Guangdong, China

Golden Elite Technology (Shenzhen) Ltd.
Shenzhen City, Guangdong, China

No. 1, Nan-Huan Rd.., ShaJing, BaoAN
Shenzhen, Guangdong, China 518104
Telephone:
+86 755 33855888

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 4/9/2022 4/9/2022 4/9/2025

Capabilities

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays

Honor Tone Ltd, HuiZhou, GuangDong Province, P.R.C.

Honor Tone Ltd.
No.61,LongShan 2nd Road
Western District of Science and Technology Park,
Da Ya Wan Economy and Technology Development District
HuiZhou, GuangDong Province, P.R.China  516081
Telephone +86-752-5378079

IPC J-STD-001 / IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 1/12/2017 2/2/2020 2/2/2023

Capabilities

  • Lead-Free Assembly Process Capable
  • Intrusive Soldering(Paste-in-Hole) Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays, Column Grid Arrays, 0201’s
  • Wire and Terminal Connection Process Capable

 

Info-Tek Electronics (Suzhou) Co., Ltd., Suzhou, P.R.C.

Info-Tek Electronics (Suzhou) Co., Ltd
183 Jinfeng Gongyèqu, Suzhou, Jiangsu China, 215011
Tel: +86 512 68088968

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 8/22/2016 11/22/2019 11/22/2022

Capabilities

  • Conformal Coating Process Capable
  • Surface Mount Component Assembly
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Unique Surface Mount Component Types to Ball Grid Arrays
  • Lead-Free Assembly Process Capable
  • Staking (Adhesive) and Encapsulation Capable

Jiangsu BDStar Navigation Electronic Co., Ltd., Suqian, Jiangsu, P.R.C

Jiangsu BDStar Navigation Electronic Co., Ltd.
NO.1, Emeishan Road, Suyu an,
Jiangsu Economic and Technical Development Zone,
Suqian, Jiangsu, P.R.C
Tel: +0527-82082175

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 11/25/2019 11/25/2019 11/25/2022

Capabilities:

  • Lead-Free Assembly Process Capable
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Surface Mount Component Assembly
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Unique Surface Mount Component Type: BGA
  • Staking (Adhesive) and Encapsulation Capable

Jiangsu Jiuzheng Powertip Technology Corporation, JiangSu Province, P.R.C.

Jiangsu Jiuzheng Powertip Technology Corporation, JiangSu Province, P.R.C.
No. 88, hua Yang North Rd.
Ju Rong Economic Development Zone
ZhenJiang City, JiangSu Province, P.R.C.  212400
Tel: +86-0511-87285858

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 12/12/2017 1/5/2021 1/5/2024

Capabilities:

  • Conformal Coating Process Capable
  • Lead-Free Assembly Process Capable
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Surface Mount Component Assembly
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Process Validation

John Deere Electronic Solutions, Fargo, ND, USA

John Deere Electronic Solutions
1441 44th Street North
Fargo ND 58102 USA
701-282-9364

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 11/6/2014 10/22/2020 10/22/2023

Capabilities:

  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Internal Failure Analysis Lab Capabilities
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Pin Staking Capable
  • Plated Through Hole Component Assembly
  • PoP (Package on Package) Process Capable
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays, Column Grid Arrays, 0201’s, 01005’s
  • Wavesolder and Selective Solder Capable

Lockheed Martin Rotary and Mission Systems, Liverpool, NY, USA

Lockheed Martin Rotary and Mission Systems
497 Electronics Pkwy, Bldg. 5 and Bldg. 6
Liverpool, NY 13088-6062
Tel: + 315-456-3304

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 2/28/2018 3/31/2021 3/31/2024

Capabilities:

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Gold (Au) Removal Process Capable
  • Process Validation
  • Rework & Repair Process Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Wire and Terminal Connection Process Capable

IPC/WHMA-A-620

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 2/28/2018 3/31/2021 3/31/2024

Magna Electronics (Zhangjiagang) Co., Ltd, Zhangjiagang City, China

Magna Electronics (Zhangjiagang) Co., Ltd
No.11, Zhenxing Road, Zhangjiagang Electronic Development Zone  –
Zhangjiagang City, Jiangsu Province China 215600

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 12/1/2016 11/30/2019 11/30/2022

Capabilities:

  • Conformal Coating Process Capable
  • Lead-Free Assembly Process Capable
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wavesolder and Selective Solder Capable
  • Internal Failure Analysis Lab Capabilities
  • Plated Through Hole Component Assembly
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.30-mm pitch), 0201’s

Mirgor S.A., Rio Grande, Tierra del Fuego, Argentina

Mirgor S.A.
Albert Einstein 1111
Rio Grande, Tierra del Fuego CP 9420
Argentina
Tel: +54 (2964) 436-400

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 7/28/2017 3/9/2022 3/9/2025

 

Capabilities:

  • Internal Failure Analysis Lab Capabilities
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
  • Wavesolder and Selective Solder Capable

Sartorius Lab Instruments GmbH & Co. KG, Gottingen, Germany

Sartorius Lab Instruments GmbH & Co. KG
Otto-Brenner-Strasse 20
Gottingen, 37079
Germany
Tel: + 0049 551 308 3103

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 11/6/2019 11/7/2019 11/7/2022

Capabilities:

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • Plated Through Hole Component Assembly
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
  • Wavesolder and Selective Solder Capable
  • Wire and Terminal Connection Process Capable
  • Process Validation

Shanghai Austor Technology Co., Ltd., Shanghai, China

Shanghai Austor Technology Co., Ltd 
3rd Floor, Building No. 2
898 Zhenchen Road, Baoshan District
Shanghai, P.R. China, 200444
Tel: + 86-21-66986866

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 7/31/2017 10/20/2020 10/20/2023

Capabilities:

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays

Shanghai Juchuan Electronics

Shanghai Juchuan Electronics
Building 2, NO.2328, Chunshen Road, Minhang District
Shanghai, 201100
China
Tel: 021-54996782

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 3/10/2022 3/10/2022 3/10/2025

 

Capabilities are as follows:

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wavesolder Capable

Shanghai Railway Communication Co., Ltd., Shanghai, P.R.C.

Shanghai Railway Communication Co., Ltd.
No. 489 Xizang North Road,
Jing’an District, Shanghai, 200071 P.R.C.

No. 179 Jiangchang West Road,
Jing’an District, Shanghai, 200071 P.R.C.

Tel:  (021) 51002158
http://shtx.crsc.cn/

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 10/8/2021 10/8/2021 10/8/2024

Capabilities:

  • Internal Failure Analysis Lab Capabilities
  • Standard Leaded (63/37) Assembly Process Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Staking (Adhesive) and Encapsulation Capable
  • Wave Solder Capable
  • Press Fit (Compliant Pin) Process Capable
  • Wire and Terminal Connection Process Capable
  • Gold (Au) Removal Process Capable
  • Cleaning Process Capable
  • Conformal Coating Process Capable

Shenzhen Top-Tek Electronics Co., LTD., Bao An District Shenzhen, P.R.C.

Shenzhen Top-Tek Electronics Co., LTD.
2F-6F, No.3 Liaokeng 3rd Industrial Zone,
Baoyuan Community, Shiyan Street,
Bao An District Shenzhen, P.R.C. 518108
Tel: + 86-755-27830356

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 8/17/2017 9/22/2020 9/22/2023

Capabilities:

  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assemblies
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wave Solder and Selective Solder Capable

STI Electronics, Inc. Madison, AL. USA

STI Electronics, Inc.
261 Palmer Rd Madison AL 35758-1727
256-461-9191

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 1/21/2015 6/10/2021 6/10/2024

J-STD-001 Space/Military Addendum

Initial Certificate Date Listing Date Expiration Date
1/21/2015 6/10/2021 6/10/2024

Capabilities

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Gold (Au) Removal Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Internal Failure Analysis Lab Capabilities
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Pin Staking Capable
  • Plated Through Hole Component Assembly
  • PoP (Package on Package) Process Capable
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
  • Wavesolder and Selective Solder Capable

Tempo Automation, San Francisco, CA. USA

Tempo Automation
2460 Alameda
San Francisco CA 94103
Tel: +1-415-320-1261

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 4/15/2019 4/1/2022 4/1/2025

J-STD-001 Space/Military Addendum

Initial Certificate Date Listing Date Expiration Date
4/15/2019 4/1/2022 4/1/2025

Capabilities

  • Cleaning Process Capable
  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
  • Wavesolder and Selective Solder Capable

Universal Global Technology (Kunshan) Co., Ltd.

Universal Global Technology (Kunshan) Co., Ltd.
Automotive Lines: S21/S27/S46/S55
No. 497, Huangpujiang Road, Qiandeng,
Kunshan, Jiangsu Province, P.R.C. 215341
Telephone # 86-512-55280000

IPC J-STD-001 / IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 5/17/2021 5/17/2021 5/17/2024

Capabilities

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: 0201’s
  • Wavesolder and Selective Solder Capable

Visit the Universal Global Technology (Kunshan) Co., Ltd. website

Zentech Dallas, LLC, Richardson, TX, USA

Zentech Dallas, LLC
1717 Firman Drive; Suite 200
Richardson, TX 75043 USA
TEL. +1 972-907-2727

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 12/10/2020 12/10/2020 12/10/2023

Capabilities:

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assemblies
  • Unique Surface Mount Component Types: Ball Grid Arrays, Micro BGA down to 0.25-mm pitch, 0201’s

A wholly owned subsidiary of Zentech Manufacturing, Inc.

Zentech Manufacturing, Inc. Baltimore, MD. USA

Zentech Manufacturing
6980 Tudsbury Road
Baltimore, MD 21244
USA
Tel: +1 443-348-4500

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 5/30/2014 9/23/2020 9/23/2023

Capabilities

  • Conformal Coating Process Capable
  • Gold (Au) Removal Process Capable
  • Cleaning Process Capable
  • Hot Bar Soldering for Rigid Flex Assembly
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Flip-Chip, Micro BGA (0.25-mm pitch), 0201’s

ZongMu Technology (Xiamen) Co., Ltd.

ZongMu Technology (Xiamen) Co., Ltd.
3rd Floor, Factory Building No. 6
Songlin Road, Guankou Town, Jimei District,
Xiamen, Fujian, 361021 P.R.C.
Tel: 0592-6363312

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 12/12/2021 12/12/2021 12/12/2024

Capabilities:

  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Internal Failure Analysis Lab Capabilities
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wave Solder Capable

IPC Validation Services

Get an edge on the competition

Get an edge on the competition

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