IPC J-STD-001S: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
The IPC Validation Services QML (Qualified Manufacturers List) is used to qualify EMS and OEM providers’ assembly processes to IPC standards.
The following manufacturers have qualified for the IPC These listed companies are on our Qualified Manufacturers List (QML) for the J-STD-001S Space/Military Addendum IPC standard:
STI Electronics, Inc, Madison, AL, USA
STI Electronics, Inc.
261 Palmer Rd Madison AL 35758-1727
256-461-9191
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 1/21/2015 | 6/10/2021 | 6/10/2024 |
IPC-1791
| Type 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Assembler | 6/14/2021 | 6/14/2021 | 6/14/2024 |
J-STD-001 Space/Military Addendum
| Initial Certificate Date | Listing Date | Expiration Date |
| 1/21/2015 | 6/10/2021 | 6/10/2024 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Gold (Au) Removal Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Internal Failure Analysis Lab Capabilities
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Pin Staking Capable
- Plated Through Hole Component Assembly
- PoP (Package on Package) Process Capable
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
- Wavesolder and Selective Solder Capable
Tempo Automation, San Francisco, CA, USA
Tempo Automation
2460 Alameda
San Francisco CA 94103
Tel: +1-415-320-1261
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 4/15/2019 | 4/1/2022 | 4/1/2025 |
J-STD-001 Space/Military Addendum
| Initial Certificate Date | Listing Date | Expiration Date |
| 4/15/2019 | 4/1/2022 | 4/1/2025 |
Capabilities:
- Cleaning Process Capable
- DFM (Design for Manufacturability) Capable
- Inspection – Automated Optical and X-Ray Capable
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
- Wavesolder and Selective Solder Capable
Zentech Dallas, LLC, Richardson, TX, USA
Zentech Dallas, LLC
1717 Firman Drive; Suite 200
Richardson, TX 75043 USA
TEL. +1 972-907-2727
J-STD-001 Space / Military Addendum
| Initial Certificate Date | Listing Date | Expiration Date |
| 2/19/2021 | 02/19/2021 | 02/19/2024 |
A wholly owned subsidiary of Zentech Manufacturing, Inc.
Zentech Manufacturing, Inc, Baltimore, MD, USA
Zentech Manufacturing
6980 Tudsbury Road
Baltimore, MD 21244
USA
Tel: +1 443-348-4500
J-STD-001 Space/Military Addendum
| Initial Certificate Date | Listing Date | Expiration Date |
| 9/9/2014 | 9/23/2020 | 9/23/2023 |